Optoelectronic component and method for producing an optoelectronic component
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United States of America Patent
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Issued Date -
Aug 27, 2015
app pub date -
Sep 26, 2013
filing date -
Sep 28, 2012
priority date (Note) -
Abandoned
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Abstract
Various embodiments may relate to an optoelectronic component, including a glass substrate, a glass layer on the glass substrate, and encapsulation, which includes a glass fit, wherein the glass frit is arranged on the glass layer. The glass frit is fastened on the glass substrate by the glass layer. The glass layer is configured as an adhesion promoter for the glass frit on the glass substrate. The glass frit is configured in such a way that a laterally hermetically tight seal of the optoelectronic component is formed by the glass frit.
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