SEMICONDUCTOR LIGHTING MODULE PACKAGE
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United States of America Patent
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app pub date -
Apr 28, 2015
filing date -
Feb 3, 2010
priority date (Note) -
Abandoned
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Abstract
A semiconductor lighting module package includes a substrate, a lead frame located on the substrate, and a semiconductor lighting element. The lead frame has a carrier portion and a connecting portion spaced from the carrier portion. The semiconductor lighting element is electrically connected with the carrier portion and the connecting portion respectively. A plurality of nanoscale reflectors are formed on the carrier portion. A plurality of nanoscale reflectors are formed on the connecting portion. Shapes of the nanoscale reflectors formed on the carrier portion are different from shapes of the nanoscale reflectors formed on the connecting portion.
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