SILVER NANOPARTICLE BASED COMPOSITE SOLAR METALLIZATION PASTE
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United States of America Patent
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app pub date -
May 8, 2015
filing date -
Jun 20, 2013
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Abstract
Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver nanoparticles, silver microparticles, and nondeformable inorganic material particles. Specific formulations have been developed that yield printed lines with low porosities and high peel strengths.
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