Pseudo-substrate with improved efficiency of usage of single crystal material
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United States of America Patent
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Feb 2, 2021
Grant Date -
Aug 27, 2015
app pub date -
Sep 6, 2013
filing date -
Sep 4, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a method for fabricating a pseudo-substrate comprising the steps of providing a single crystal ingot, providing a handle substrate, cutting a thin slice from the single crystal ingot, and attaching the thin slice to the handle substrate to form a pseudo-substrate. According to the invention, the thickness of the thin slice is substantially equal or inferior to a critical thickness below which the slice, if taken alone, is no longer mechanically stable. The invention further relates to a semiconductor structure.
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 2, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 2, 2032 |
