CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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United States of America Patent
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Aug 27, 2015
app pub date -
Jul 18, 2014
filing date -
Feb 21, 2014
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Abstract
A cluster type semiconductor processing apparatus and a method for manufacturing a semiconductor device using the same are provided. The cluster type semiconductor processing apparatus includes a polyhedral transfer module to transfer a wafer, a first process module communicating with the transfer module, a degassing process of removing fumes from a surface of the wafer being performed in the first process module, a second process module communicating with the transfer module, a plasma cleaning process of cleaning the surface of the wafer being performed in the second process module, a standby module communicating with the transfer module, the wafer having undergone the degassing process and the plasma cleaning process being maintained in the standby module for a certain time, and a third process module communicating with the transfer module, a metal sputtering process of depositing a metal film on the wafer being performed in the third process module.
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