SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150243490A1
SERIAL NO

14633123

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Abstract

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The present invention relates to a substrate processing apparatus and a substrate processing method, the substrate processing apparatus including: a load-lock chamber; a transfer chamber disposed on one side of the load-lock chamber; a process chamber disposed on one side of the transfer chamber; and a substrate transfer robot disposed inside the transfer chamber to transfer a substrate between the load-lock chamber and the process chamber, wherein the process chamber includes a plurality of substrate support plates configured to support the substrate, a plurality of gas spray units configured to respectively spray process gases on the plurality of substrate support plates, a turntable configured to transfer the substrate between the plurality of substrate support plates, a first gate through which an unprocessed substrate is taken in, and a second gate through which a processed substrate is taken out; and the substrate transfer robot independently transfers the unprocessed substrate and the processed substrate through the first gate and the second gate, thereby improving substrate processing efficiency.

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Patent Owner(s)

Patent OwnerAddress
WONIK IPS CO LTDSOUTH KOREA GYEONGGI DO PING ZE ZHENWEI ZHENWEI GROUP PRODUCED 75 ROAD SURFACE PYEONGTAEK GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAM, Tae Ho Pyeongtaek-Si, KR 3 11
KIM, Yong Jin Anseong-Si, KR 210 1372
LEE, Kyung Eun Yangju-Si, KR 17 234
RYU, Dong Ho Namyangju-Si, KR 4 26

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