OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME
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United States of America Patent
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Issued Date -
Aug 27, 2015
app pub date -
Jan 30, 2015
filing date -
Feb 21, 2014
priority date (Note) -
Abandoned
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Abstract
An optical communication module includes a circuit board, a photoelectric converting unit, and an optical coupler. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface, a hot-curable adhesive layer formed on the first surface, and a metal reflective layer formed on the second surface and aligned with the hot-curable adhesive layer. The photoelectric converting unit is mounted on the first surface. By virtue of the function of the metal reflective layer in the heat curing process, the optical coupler is precisely fixed to the substrate via the hot-curable adhesive layer.
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