Microstructure Sucker Device and Operation Method Thereof
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United States of America Patent
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app pub date -
Dec 31, 2014
filing date -
Feb 24, 2014
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Abandoned
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Abstract
A microstructure sucker device includes a substrate, a microstructure and an operation surface. The microstructure is arranged on the first surface of the substrate to form a microstructure sucker layer. The operation surface is provided on the second surface of the substrate and corresponds to the surface sucker layer. An operation method of the microstructure sucker device includes: aligning the sucker layer with a predetermined surface; attaching the microstructure sucker layer to the predetermined surface; pressing the microstructure sucker layer to discharge an amount of air from the microstructure sucker layer to suck the predetermined surface; pulling an edge of the microstructure sucker layer to separate the microstructure sucker layer from the predetermined surface.
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