SEMICONDUCTOR PACKAGE AND METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Nov 25, 2014
filing date -
Feb 14, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor package and manufacturing method thereof are disclosed. The semiconductor package includes a package carrier, a chip, a film, a first shielding metal plate and an encapsulating material. The package carrier has at least one conductive component. The chip has an active surface and a corresponding back surface. The back surface of the chip is attached to the package carrier. At least one contact point is disposed on the active surface and is electrically coupled to the conductive component by a wire. The film is disposed on the active surface and covers a portion of the wire. The first shielding metal plate is disposed on the film. The encapsulating material covers the chip, the wire, at least one portion of the package carrier, the film and at least one portion of the first shielding metal plate.
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