FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOF
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Jul 10, 2014
filing date -
Feb 17, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip-chip packaging substrate is provided, which includes: a substrate body; a plurality of conductive pads formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having a plurality of openings correspondingly exposing a portion of each of the conductive pads; and a metal layer formed on each of the conductive pads in the openings, wherein the metal layer has a top surface having a lowest point lower than a top surface of the insulating layer, and a thickness ratio of the metal layer to the insulating layer is greater than or equal to 1/4 and less than 1, thereby preventing a solder bridge or short circuit from occurring.
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