Curable Silicone Composition, Method For Producing Semiconductor Device, And Semiconductor Device
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United States of America Patent
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Aug 20, 2015
app pub date -
Sep 6, 2013
filing date -
Sep 10, 2012
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Abstract
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (A-2) a resin-like organopolysiloxane including 1.5 to 5.0% by weight alkenyl groups; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a linear dialkyl polysiloxane having a viscosity at 25° C. of 2 to 10 mm2/s and having alkenyl groups capping both molecular chain terminals; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having low surface tackiness and a low coefficient of friction.
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