MAGNETRON SPUTTERING APPARATUS AND MAGNETRON SPUTTERING METHOD
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Oct 26, 2012
filing date -
Oct 26, 2012
priority date (Note) -
Abandoned
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Abstract
A magnetron sputtering apparatus including a first magnet array arranged helically, a second magnet array arranged side by side with the first magnet array, a stationary magnet disposed in the circumference of the first and second magnet arrays, a magnet rotation mechanism causing the first and second magnet arrays to rotate around a rotation axis, and a plurality of magnetic induction members which is disposed between the outer perimeter of the first and second magnet arrays and the stationary magnet in a direction crossing the rotation axis direction and arranged in the rotation axis direction when viewed from the side of a target, and attracts magnetic force lines coming out from the first magnet array to guide the magnetic force lines to the side of the target or attracts magnetic force lines coming in from the side of the target to guide the magnetic force lines to the second magnet array.
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