APPARATUS FOR IMAGING PLASMA PARTICLES AND METHOD FOR DETECTING ETCHING END POINT USING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 20, 2015
app pub date -
Sep 3, 2013
filing date -
Sep 10, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided are an apparatus for photographing plasma particles and a method for detecting an etch endpoint using the apparatus. The method includes: receiving, according to time, a captured image of particles in a plasma chamber in which a thin film on a wafer is being etched; calculating a number of pixels within a predetermined grayscale range in the captured image; calculating, according to points of time, an accumulated average value of the number of pixels up to a current point of time; and detecting an etch endpoint that is a completion time of etching by using the accumulated average value calculated according to points of time.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully