MEMORY PACKAGE TEST JIG HAVING HARSH CONDITION CREATING STRUCTURE
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
May 21, 2014
filing date -
Feb 18, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein is a memory package test jig having a harsh condition creating structure. The memory package test jig includes an upper jig which has package seating holes into which memory packages are seated, a lower jig which fixes a socket board in a place between it and the upper jig, a pusher housing which is hinged to the upper jig, a lift panel which is installed below the pusher housing so as to be vertically movable, a pressing panel which vertically moves the lift panel, a lift means which is provided to embody the vertical movement of the lift panel, a pusher block which presses the memory packages, a harsh-thermal-environment creating unit which creates harsh thermal conditions, a cooling unit which conducts a cooling operation when the harsh-thermal-environment creating unit generates or absorbs heat, and a lift lever which linearly move the pressing panel leftwards or rightwards.
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