THERMALLY CONDUCTIVE POROUS MEDIA
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
Sep 14, 2012
filing date -
Sep 15, 2011
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Abstract
The present invention relates to compositions comprising a thermally conductive porous media, optionally linked to a heat spreading interfacial material. These compositions provide heat dissipation from a heat source. These compositions can be used in a variety of applications including effective removal of heat from electronic and other enclosed devices.
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