Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting
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United States of America Patent
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Aug 8, 2017
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N/A
app pub date -
Feb 4, 2015
filing date -
Feb 17, 2014
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Abstract
A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.
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