Method for eutectic bonding of two carrier devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 20, 2015
app pub date -
Feb 13, 2015
filing date -
Feb 17, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for eutectic bonding of two carrier devices, including the tasks of putting a first layer of a first bonding material on the first carrier device, putting a first layer of a second bonding material on the second carrier device, putting a second layer of the second bonding material, that is thin in relation to the first layer of the first bonding material, on the first layer of the first bonding material, and providing the eutectic bonding of the two carrier devices.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully