Method of sealing and shielding for dual pressure MEMs devices
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United States of America Patent
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Nov 1, 2016
Grant Date -
Aug 20, 2015
app pub date -
Apr 29, 2015
filing date -
Aug 29, 2013
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Abstract
The present disclosure relates to a MEMs substrate. In some embodiments, the MEMs substrate has a device substrate having a micro-electromechanical system (MEMs) device, and a layer of bonding material positioned over the device substrate at positions adjacent to the MEMs device. A cap substrate has a depression is disposed within a surface abutting the layer of bonding material. The depression within the cap substrate forms a chamber vertically disposed between the device substrate and the cap substrate and abutting the MEMs device. One or more pressure tuning channels are vertically disposed between the device substrate and the cap substrate and laterally extend outward from a sidewall of the chamber.
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