FORMING CONDUCTIVE PATTERNS USING INK COMPRISING METAL NANOPARTICLES AND NANOWIRES

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United States of America Patent

APP PUB NO 20150231874A1
SERIAL NO

14401209

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Abstract

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Disclosed herein are systems and methods for manufacturing a conductive pattern using ink comprising nano-catalysts such as metal nanoparticles and nanowires. The geometry of the printed pattern, nanoparticle content of the ink, and conductivity desired for the end application of the product, alone or in combination with these or other factors, may support a manufacturing process where a conductive pattern may be formed without electroless plating, without curing, or with a modified plating and/or curing procedures.

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Patent Owner(s)

Patent OwnerAddress
HUDSON BAY FUND LP AS COLLATERAL AGENT777 THIRD AVENUE 30TH FLOOR NEW YORK NY 10017

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jin, Danliang The Woodlands, US 44 344

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