SOLDERING METHOD FOR POLYMER THICK FILM COMPOSITIONS
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United States of America Patent
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Aug 20, 2015
app pub date -
Feb 9, 2015
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Feb 18, 2014
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Abstract
A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material.
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