Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
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United States of America Patent
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Jul 18, 2017
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app pub date -
Feb 6, 2015
filing date -
Feb 10, 2014
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Abstract
A conduction structure includes a device substrate (first substrate), an IC (second substrate) having an upper surface and an end surface, a sealing plate (third substrate) having an upper surface and an end surface, a conductive layer having a first part provided on an upper surface of the device substrate, a second part provided on the end surface of the IC and connected to the first part, a third part provided on the upper surface of the IC and connected to the second part, and a fourth part provided on the end surface of the sealing plate and connected to both of the first part and the second part, and a plating layer overlapped with the conductive layer.
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