FRONT FACING PIGGYBACK WAFER ASSEMBLY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Dec 15, 2014
filing date -
Nov 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Front facing piggyback wafer assembly. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. The plurality of integrated circuit devices are singulated to form individual integrated circuit devices. The carrier wafer may be processed to form integrated circuit structures prior to the attaching.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully