METHOD FOR FORMING CONDUCTOR IN MINUTE SPACE
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United States of America Patent
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Issued Date -
Aug 13, 2015
app pub date -
Nov 25, 2014
filing date -
Feb 13, 2014
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Abandoned
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Abstract
A method for forming a conductor in a minute space of an object includes the steps of filling a first metallic material into the minute space, the first metallic material being composed of particles and dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium inside the minute space; and feeding a second metallic material into the minute space, wherein the first and second metallic materials, in combination, include a combination of a high-melting metallic material and a low-melting metallic material.
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