Heat Pipe Structure and Thermal Module Using Same
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United States of America Patent
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Issued Date -
Aug 13, 2015
app pub date -
Feb 12, 2014
filing date -
Feb 12, 2014
priority date (Note) -
Abandoned
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Abstract
A thermal module includes a heat pipe structure, a plurality of heat radiation fins and a fan. The heat pipe structure includes a pipe having a first end, a second end and a middle section. The first and the second end are located adjacent to each other and form two heat-absorption sections, and the middle section forms a heat-dissipation section and is extended from the first end to the second end in a curve to have a substantially round shape defining a central opening. The heat radiation fins are arranged on the middle section of the pipe. The fan is correspondingly mounted to the heat-dissipation section and is faced to the heat radiation fins. With these arrangements, the thermal module is cost-effective and has largely upgraded heat transfer efficiency.
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