Methods and Apparatus for Laser Cleaning
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United States of America Patent
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N/A
Issued Date -
Aug 13, 2015
app pub date -
Jan 8, 2015
filing date -
Jul 10, 2012
priority date (Note) -
Published
status (Latency Note)
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Abstract
A method of cleaning a substrate (16, 24, 34, 64, 71, 82, 102, 165, 171, 181, 201, 300, 310) with optical energy can comprise applying optical energy from a source of optical energy (12, 21, 31, 91, 103, 114, 121, 131, 141, 151, 164, 191, 202) to the substrate. The method can comprise applying the optical energy to a substrate having a cleaning agent applied thereto, the optical energy having one or more optical parameters selected for cleaning the substrate. The method can comprise reading data from a data bearing element (173) associated with the substrate, communicating the data to a processor (154) associated with a cleaning appliance (10, 30, 40, 60, 70, 80, 90, 110, 120, 130, 140, 150, 161, 200) comprising the source of optical energy, wherein the processor, responsive to the communicated data, controls the cleaning of the substrate with the optical energy. The method can comprise slidingly contacting the substrate with a work surface, said work surface comprising an aperture (83, 117) and emanating optical energy from the aperture for cleaning the substrate. A cleaning appliance can comprise an appliance body (80, 90, 104, 125) comprising an aperture for emanating optical energy for cleaning the substrate and an optical transmission pathway arranged for propagating optical energy received from an optical energy source to said aperture. The appliance can be adapted and constructed for delivering a cleaning agent to the substrate. The appliance can include a processor, a data interface in communication with the processor, and can be configured such that the processor outputs signals that control the cleaning of the substrate, the processor being configured for controlling, responsive to data received by the data interface and via the output signals, the substrate cleaning. The cleaning appliance can include a suction pump (142) for removing material from the substrate.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
WOODROW SCIENT LTD | Not Provided |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Clowes, John Redvers | New Milton, GB | 41 | 331 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 13, 2027 |
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