ELECTROLYTIC COPPER FOIL, CLEANING FLUID COMPOSITION AND METHOD FOR CLEANING COPPER FOIL

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United States of America Patent

SERIAL NO

14695395

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Abstract

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An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

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Patent Owner(s)

Patent OwnerAddress
CHANG CHUN PETROCHEMICAL CO LTD7F NO 301 SONGJIANG RD ZHONGSHAN DIST TAIPEI CITY 104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Kuei-Sen Taipei City, TW 26 88
CHOU, Jui-Chang Taipei City, TW 42 76
JUO, Tsang-Jin Taipei City, TW 4 2
LAI, Yao-Sheng Taipei City, TW 43 65
LIU, Yueh-Min Taipei City, TW 4 7
LO, Hsi-Hsing Taipei City, TW 4 9

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