SINTER MOLD MATERIAL, SINTERING AND MOLDING METHOD, SINTER MOLD OBJECT, AND SINTERING AND MOLDING APPARATUS
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United States of America Patent
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Issued Date -
Aug 13, 2015
app pub date -
Jan 21, 2015
filing date -
Feb 7, 2014
priority date (Note) -
Abandoned
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Abstract
A sintering and molding method includes forming a fluid mold material by heating a sinter mold material, which includes inorganic particles, a binder material and a binder material which bond together the inorganic particles, to a temperature equal to or more than the melting points of the binder materials, forming a mold layer by spreading the fluid mold material, layering a mold layer, applying UV ink to a desired region on the mold layer, forming a mold cross sectional pattern by curing the UV ink which is applied to a desired region on the mold layer, finishing a mold object by removing a region, where the UV ink is not applied, in the mold layer, carrying out heat treatment on the mold object at a temperature which is less than the initial temperature of thermal decomposition of the binder material, and carrying out sintering treatment on the mold object.
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