OPTICAL SENSOR DEVICE
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United States of America Patent
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N/A
Issued Date -
Aug 6, 2015
app pub date -
Jan 23, 2015
filing date -
Feb 4, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package for an optical sensor device has a double molding structure in which a first resin molded portion (1) and a second resin molded portion (2) are subjected to contact fitting. The first resin molded portion (1) has a structure in which peripheries of a die pad portion (8) on which an optical sensor element (5) is mounted and a part of leads (3a, 3b) are molded with a resin so as to be integrated. The second resin molded portion (2) has a structure in which the periphery of the first resin molded portion (1) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate (4) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.
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