MULTI-LAYER DEVICES UTILIZING LAYER TRANSFER
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United States of America Patent
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app pub date -
Sep 25, 2013
filing date -
Sep 26, 2012
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Abstract
An apparatus is disclosed that includes a first plurality of devices made of a group III-V semiconductor material and a second plurality of devices made of a semiconductor material different than the material of the first plurality of devices that are bonded to the first plurality of devices. The apparatus also includes a dielectric layer surrounding the first plurality of devices and the second plurality of devices to mechanically bond the first plurality of devices to the second plurality of devices.
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