LAYOUT FOR RETICLE AND WAFER SCANNING ELECTRON MICROSCOPE REGISTRATION OR OVERLAY MEASUREMENTS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Apr 15, 2015
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and a resulting device are provided for forming stack overlay and registration monitoring structures for FEOL layers including implant layers and for forming BEOL SEM overlay and registration monitoring structures including BEOL interconnections, respectively. Embodiments include forming an active monitoring structure having first and second edges separated by a first distance in an active layer on a semiconductor substrate; forming a poly monitoring structure having first and second edges separated by a second distance in a poly layer; and forming one or more contact monitoring structures in a contact layer, collectively exposing at least the first and second edges of each of the active and poly monitoring structures; wherein the active, poly, and contact monitoring structures are formed in an area which includes no IC patterns in the active, the poly, and the contact layers, respectively.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully