ENCAPSULANT COMPOSITION
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United States of America Patent
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Issued Date -
Aug 6, 2015
app pub date -
Jan 26, 2015
filing date -
Jan 31, 2014
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Abandoned
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Abstract
Compositions that have relatively high Tg, relatively low CTE, and relatively low modulus are suitable for use as encapsulants with stress-sensitive electronic assemblies, such as those containing low k dielectrics. These compositions are used in methods of die attachment, encapsulation, and solder bump reinforcement.
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