MEMS DEVICE WITH SPLIT PAD PACKAGE
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United States of America Patent
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Issued Date -
Aug 6, 2015
app pub date -
Jan 31, 2014
filing date -
Jan 31, 2014
priority date (Note) -
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Abstract
A device and a microphone are disclosed. The device comprises a circuit board and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. The microphone comprises a circuit board, a seal structure on the circuit board, and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other.
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