METHOD FOR CUTTING OBJECT TO BE PROCESSED

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United States of America Patent

SERIAL NO

14422415

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Abstract

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The object cutting method comprises the steps of locating a converging point of laser light within a monocrystal sapphire substrate, while using a rear face of the monocrystal sapphire substrate as an entrance surface of the laser light, and relatively moving the converging point from one side to the other side along each of a plurality of lines to cut set parallel to the a-plane and rear face of the substrate, so as to form a modified region within the substrate along each line; and thereafter exerting an external force on the object along each line, so as to extend a fracture occurring from the modified region, thereby cutting the object along each line.

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Patent Owner(s)

Patent OwnerAddress
HAMAMATSU PHOTONICS K K1126-1 ICHINO-CHO HIGASHI-KU HAMAMATSU-SHI SHIZUOKA 435-8558

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamada, Takeshi Hamamatsu-shi, JP 301 2619

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