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Abstract

An electronic assembly includes a heat generating element, a heat dissipation fin set disposed above the heat generating element, a filter circuit board, and a heat conducting layer. The filter circuit board is located between the heat generating element and the heat dissipation fin set, and includes a metal layer, an electromagnetic band gap structure layer, and an insulation layer. The metal layer has a first opening and contacts the heat dissipation fin set. The electromagnetic band gap structure layer has conductive patterns. Thermal vias pass through the insulation layer and connect to the metal layer. The heat generating element contacts the conductive patterns. The insulating layer is disposed between the metal layer and the electromagnetic band gap structure layer, and has a second opening and a peripheral region aligned to the conductive patterns. The heat conducting layer contacts the heat dissipation fin set through the first and second openings.

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First Claim