Semiconductor device having multiple contact clips
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United States of America Patent
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Dec 5, 2017
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app pub date -
Jan 28, 2014
filing date -
Jan 28, 2014
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Abstract
A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.
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