SEMICONDUCTOR STRUCTURE

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United States of America Patent

APP PUB NO 20150214161A1
SERIAL NO

14288966

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor structure comprising a tray, a chip, a first grounding wire and a second grounding wire is provided. The tray has a first surface and a second surface, and there is a height difference existing between the first surface and the second surface. The chip is disposed on the first surface of the tray and has an active surface. The first grounding wire connects the active surface and the second surface. The second grounding wire connects the first surface and the second surface.

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Patent Owner(s)

Patent OwnerAddress
ALI CORPORATION6F NO 1 JINSHAN 8TH ST HSINCHU 300

International Classification(s)

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  • 2014 Application Filing Year
  • H01L Class
  • 23828 Applications Filed
  • 21803 Patents Issued To-Date
  • 91.51 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2014201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Ho-Wei Hsinchu, TW 1 0

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1377800619237183722181459473474314501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +05001000150020002500300035004000450050005500600065007000750080008500

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