MANUFACTURING METHOD OF SELECTIVE ELECTRONIC PACKAGING DEVICE
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United States of America Patent
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Issued Date -
Jul 30, 2015
app pub date -
Apr 6, 2014
filing date -
Jan 24, 2014
priority date (Note) -
Abandoned
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Abstract
A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component.
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