MEMORY CHIP AND MEMORY STORAGE DEVICE
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United States of America Patent
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Issued Date -
Jul 30, 2015
app pub date -
Apr 29, 2014
filing date -
Jan 29, 2014
priority date (Note) -
Abandoned
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Abstract
A memory chip is disclosed. The memory comprises a substrate and a plurality of memory pads. The plurality of memory pads are disposed around the substrate so as to form a pattern, and the plurality of memory pads are configured in a mirror horizontal manner and with layout line connectivity, so as to simplify complexity of layout line. Mirror solder ball map of the instant disclosure increases design flexibility and convenience of integrating line characteristics of the end product's application, and is easy to achieve the design of doubling the memory capacity.
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