RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER

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United States of America Patent

APP PUB NO 20150210849A1
SERIAL NO

14419892

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Abstract

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Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass fiber coated with a sizing agent and 2 to 20 parts by weight of a laser direct structuring additive, wherein the sizing agent comprises at least one selected from a polyolefin resin and a silicone resin.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ENGINEERING-PLASTICS CORPORATIONTOKYO 105-0021

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Hiroyoshi Hiratsuka-shi, JP 33 260
Motegi, Atsushi Hiratsuka-shi, JP 26 21

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