MEMS Chip and Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Jul 30, 2015
app pub date -
Oct 2, 2014
filing date -
Jan 27, 2014
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Abandoned
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Abstract
A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.
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