COMPONENTS AND METHOD FOR PRODUCING COMPONENTS
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United States of America Patent
Stats
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N/A
Issued Date -
Jul 23, 2015
app pub date -
Aug 8, 2013
filing date -
Aug 10, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Various embodiments may relate to a component, including a carrier, a first electrode on or over the carrier, an organic functional layer structure on or over the first electrode, a second electrode on or over the organic functional layer structure, and thin film encapsulation. The first electrode and the second electrode are configured in such a way that an electrical connection of the first electrode to the second electrode is established only through the organic functional layer structure. The first electrode and/or the second electrode is electrically coupled to the carrier. The thin-film encapsulation together with the carrier forms a structure which seals the organic functional layer structure as well as at least one electrode out of the first electrode and the second electrode hermetically against water and/or oxygen.
First Claim
Other Claims data not available