SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jul 23, 2015
app pub date -
May 8, 2012
filing date -
May 8, 2012
priority date (Note) -
Abandoned
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Abstract
For a semiconductor package mounted on a mounting member with wiring which connects an electrode on the upper surface of an LED device (semiconductor device) and an electrode at the mounting member side formed by a droplet discharge method or printing method, a stress relaxation film to reduce stresses applied to the wiring due to the difference in expansion/contraction between a land at the level difference sections and the wiring is formed at least at the level difference sections in the land which forms wiring, and the wiring is formed by a droplet discharge method or printing method on the stress relaxation film. The stress relaxation film may be formed of an insulating material for which the difference of the linear expansion coefficient from wiring is as small as possible and for which the Young's modulus is as large as possible.
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