METHOD OF MODIFYING POLYSILICON LAYER THROUGH NITROGEN INCORPORATION FOR ISOLATION STRUCTURE

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United States of America Patent

APP PUB NO 20150206789A1
SERIAL NO

14157855

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Abstract

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The present disclosure relates to a method of modifying a polysilicon layer, which includes the following steps. A polysilicon layer is provided. Nitrogen is incorporated into the polysilicon layer toward a predetermined depth. The polysilicon layer incorporated with nitrogen is etched, wherein after the nitrogenized polysilicon is removed, the formation of the remaining polysilicon layer is nearly indistinguishable from the formation of the polysilicon layer.

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Patent Owner(s)

Patent OwnerAddress
NANYA TECHNOLOGY CORPORATIONNO 98 NANLIN RD TAISHAN DIST NEW TAIPEI CITY 243

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, CHENG SHUN MIAOLI COUNTY, TW 9 64
FAN, DARWIN BOISE, US 4 8
MARIOTTINI, GIORGIO BOISE, US 6 12
PAPPAS, JONATHAN PERRYSBURG, US 9 448
WU, HSIAO TING YILAN COUNTY, TW 1 2

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