METHOD AND SYSTEM FOR CO-PACKAGING GALLIUM NITRIDE ELECTRONICS
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United States of America Patent
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app pub date -
Dec 5, 2014
filing date -
Dec 28, 2012
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Abandoned
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Abstract
A method of fabricating an electronic package includes providing a package comprising a leadframe and a plurality of pins and providing a gallium nitride (GaN) transistor comprising a drain contact, a source contact, and a gate contact. The method also includes joining the drain contact to the leadframe and providing a GaN diode comprising an anode contact and a cathode contact. The method further includes joining the anode contact to the leadframe.
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