ELECTRICAL CHARGE REGULATION FOR A SEMICONDUCTOR SUBSTRATE DURING CHARGED PARTICLE BEAM PROCESSING

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United States of America Patent

SERIAL NO

14602318

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A method for preparing a semiconductor target (10), the method comprising providing a semiconductor substrate (12) including a main substrate surface (14) which defines a substrate periphery (20) along an outer edge. The semiconductor substrate (12) further has an structure layer (30) arranged on the main substrate surface, and comprising a structure layer periphery (32) that is located inwards with respect to the substrate periphery, so as to leave exposed a peripheral substrate region (22) along the substrate periphery. The method further comprises applying an electrically conductive layer (38) on the structure layer, wherein the electrically conductive layer extends beyond the structure layer periphery to establish electrical contact in a contacting portion (23) of the peripheral substrate region.

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Patent OwnerAddress
ASML NETHERLANDS B VP O BOX 324 VELDHOVEN 5500 AH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BRANDT, Pieter Lucas Rotterdam, NL 4 1

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