POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD

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United States of America Patent

SERIAL NO

14597656

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTD402 FENGJEN RD JENWU DIST KAOHSIUNG CITY

International Classification(s)

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  • 2015 Application Filing Year
  • B24B Class
  • 630 Applications Filed
  • 508 Patents Issued To-Date
  • 80.64 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FENG, CHUNG-CHIH Kaohsiung City, TW 112 308
HUNG, YUNG-CHANG Kaohsiung City, TW 45 119
LIU, WEI-TE Kaohsiung City, TW 10 28
WANG, CHUN-TA Kaohsiung City, TW 13 25
YAO, I-PENG Kaohsiung City, TW 79 189

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Patent Citation Ranking

  • 1 Citation Count
  • B24B Class
  • 16.04 % this patent is cited more than
  • 10 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges14960610721171033641201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650

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