COPPER PARTICLE COMPOSITION
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United States of America Patent
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Issued Date -
Jul 16, 2015
app pub date -
Jan 15, 2015
filing date -
Jan 15, 2014
priority date (Note) -
Abandoned
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Abstract
Conductive patterns are formed using formulations containing metallic particles, which may be copper. These metallic particles may be coated with a binder material that improves adhesion during photosintering of the formulations. The binder contains chemistry suitable for it to be removed from the particles in a separate process such as drying or thermal sintering. The coating is a non-volatile organic compound attached to the metallic particles with a minimum thickness oxide coating. The organic coating improves a coefficient of thermal expansion value match between the metallic particles and the substrate, which may be polymeric.
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