FABRICATING A VIA
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 16, 2015
app pub date -
Jan 15, 2014
filing date -
Jan 15, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In one aspect, a method of fabricating a via in a hole of an isolation material includes depositing a first conductive material in the hole of the isolation material, removing a portion of the first conductive material deposited in the hole, depositing a second conductive material on the first conductive material in the hole and removing, using chemical-mechanical polishing (CMP), a portion of the second conductive material deposited on the first conductive material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully