HEAT-DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Jul 9, 2015
app pub date -
Dec 11, 2014
filing date -
Jan 4, 2014
priority date (Note) -
Abandoned
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Abstract
A heat-dissipation assembly is applied in an electronic device having a heat source. The heat-dissipation assembly includes a graphite sheet, a dissipation fin, and a dissipation fin. The first graphite sheet is attached to the first heat source. The dissipation fin includes a first end portion attached to the first graphite sheet, and can absorb heat generated by the first heat source. The dissipation fin is attached to the dissipation fin, and receives cooling liquid to dissipate the heat generated by the first heat source.
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