LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Oct 29, 2014
filing date -
Dec 30, 2013
priority date (Note) -
Abandoned
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Abstract
A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies.
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